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Reballing Tasks


  •  BGA Reballing  -  Lead Free Balls
  •  BGA Reballing  -  Leaded Balls
  •  BGA Reballing  -  Re-Alloying
  •  IC Refurbishment


Reballing technologies are becoming more and more common. The reasons are low availability of components and the re-usage of expensiveIC’s. Our customers often request re-alloying of components and some designs still have the need for leaded components, which may on no longer be available on the market.

To perform this Task, we use a gentle process, which is certified by the Fraunhofer Institute. The process of re-melting will be performed under Nitrogen on our Finetech machines. The component will only undergo one thermal cycle.